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MICROLENSES DEPOSITION FOR BACKSIDE-ILLUMINATED IMAGERS - EXPRO PLUS

ESA Open Invitation To Tender AO8624
Open Date: 21/07/2016
Closing Date: 30/09/2016 13:00:00


Status: ISSUED
Reference Nr.: 16.1QM.11
Prog. Ref.: TRP
Budget Ref.: E/0901-01 - TRP
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Parts / Mechanical, Optical and Magnetic parts / Optical Parts (lenses, beam-splitters, ...)
Technology Domains: EEE Components and Quality / EEE Component Technologies / Optoelectronic Active and Passive Components
Establishment: ESTEC
Directorate: Directorate of Technical & Quality Management
Department: Product Assurance and Safety Department
Division: Materials & Components Technology Division
Contract Officer: Pratesi, Giulia
Industrial Policy Measure: C1 - Activities in open competition limited to the non-Larg...
Last Update Date: 21/07/2016
Update Reason: Tender issue

Micro lenses are today widely used within consumer imaging products, not only in order to compensate for non 100% fill factor but also in view of improving MTF (e.g. for back side illuminated devices). Such microlenses are manufactured within the standard flow ofCIS foundries. They are mainly directed at pixel pitch in the 1-5 μm range and are unable to efficiently address the usual space applications pitch range- about 5 to 100 μm-, while there is a need for such devices for performance improvements (fill factor, MTF, Parasitic Light Sensitivity, etc.). This proposal addresses specifically Back-illuminated CIS. The first step of this study is to review the existing European processes dedicated to microlenses deposition on backside illuminated image sensors, in terms of technological capabilities (pitch, available geometry), performances (dead zone/fill factor, transmission, deposition accuracy, uniformity etc.) and space qualification. Based on the selection of the most appropriate process, the second part of the study will consist the procurement of back-illuminated CMOS image sensor wafers, with the intention to deposit microlenses on. The final product will be subjected to a first space assessment, followed by a space evaluation campaign based on the ESCC 9020.In short, the tasks included in this activity are:- To review existing European processes dedicated to microlenses deposition- To review and consolidate requirement Specification and Components Production Process Identification as well as reliability analysis.- To draft an Evaluation Test Plan (ETP).- To plan and procure a selected CMOS image sensor that will be used to evaluate the microlens technology chosen.- To design, manufacture/deposit microlenses on a CIS.- To perform a test campaign to evaluate microlenses and their enhancement of the CIS based on the ETP plan Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and RD entities in ESA programmes".

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