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SPACE VALIDATION OF GLASS LID SOLDERING TECHNIQUES TO HERMITICALLY SEAL SMALL SIZE OPTO ELECTRONIC PARTS (T723-407QT) - EXPRO PLUS

ESA Open Invitation To Tender AO8394
Open Date: 21/07/2015
Closing Date: 02/10/2015

Status: ISSUED
Reference Nr.: 15.1QM.14
Prog. Ref.: TRP
Budget Ref.: E/0901-01 - TRP
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL
Tender Type: C
Price Range: 200-500 KEURO
Establishment: ESTEC
Directorate: Directorate of Technical & Quality Manag
Department: Product Assurance and Safety Department
Division: Materials & Components Technology Divisi
Contract Officer: Casini, Gian Lorenzo
Last Update Date: 21/07/2015
Update Reason: Tender issue

Objectives: Optoelectronic parts have a window glued, which sometimes suffers humidity damage due to a non-hermetic seal. The main objective of the activity will be therefore to space validate a generic package solution that would be available to die manufacturers and the space community. This activity will focus only on small size opto parts (<10 mm), excluding image sensor whose active areacan be very large. Through this generic packaged, components such as LEDs, VCSELs, phototransistors, photodiodes can be addressed. Description: Most of the optoelectronic parts have a window glued on the package. Although, these parts can pass the fine leak test, they are not hermetic. Therefore, a risk of failure due to the presence of humidity is not excluded. Some projects recently observed some failure due to dendrite growth inside non hermetic package (phototransistor) during on-ground testing at equipment level. Inorder to improve the confidence in using opto-parts, it is therefore needed to have hermetic packaged. Task1: The first task will start with the study of the different techniques of glass lid soldering on small size packages (<10 mm). The techniques to be investigated shall include as minimum the brazing of the glass windows into the ceramic package with different soldering allows and metal deposition, other techniques such as full glass packages or seam welding between the lid and the package. Task 2: The contractor shalldevelop an hermetic package solution based on the most promising technique selected during Task1. The developed packaged shall gothrough a space assessment programme including specific tests stressing the package. In order to be representative of the component conditions during testing, ESA will provide the dies to be assembled into the package. Procurement Policy: C(1) = Activity restrictedto non-prime contractors (incl. SMEs). For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and R&D entities in ESA programmes".

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